


Note: Packaged LED material is silicone nature, therefore, LED has is a soft and flexible surface.
Although characteristics of silicone is to reduce thermal stress, but it is more susceptible to
mechanical damage to the external forces applied on the surface. Pressure affects the reliability of light emitting diodes. In such circumstances, the assembly of organic silicon encapsulated LED products must comply
with the appropriate measures to deal with. Avoid any pressure applied to any part of the LED and use pneumatic nozzle. Otherwise it may lead to reduction in reliability, and impact of its life to the LED.
Recommend the use of pure alcohol to clean, wash and wipe or dipping no more than 1
minutes after soldering. When different solvents are used for cleaning, make sure that
solvents do not damage the light emitting diode packaging.
(Storage)
1. Recommended storage conditions before opening packaging: 5 ºC -30 ºC / <60% RH,
retention period of one year.
2. After opening of packaging: Room temperature <30 ° C, humidity < 60% RH. It is
recommended to complete the reflow soldering operations in 4Hours. Complete LED
packaging operations within 12 hours. If LED
absorbed moisture prior to high temperature reflow soldering process, it will cause silicone
and PPA to separate leading to component failures. Unused products, perform
dehumidification procedure (reel products 75 ° C ± 5 ° C / 12H, bulk products,
110 ° C ± 5 ° C / 1H, natural cooling 1H inside oven) before reuse.
3. In the case of vacuum packing leakage, do not use,Use only after.



