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| Customization: | Available |
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| LED Packaging Type: | Chip |
| Chip Material: | InGaN |
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| Item |
RZX-S5050CW-10W |
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Dimension
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5.0mm×5.0mm×3mm
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Wide viewing angle
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120 |
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Luminous Flux
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800-960LM |
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Color Temperature
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5000-8300K |
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Forward Voltage
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3.0-3.6V |
| Power |
10W |
| Current |
3000mA |
Relative Spectral Power Distribution
Packaged LED material is silicone nature, therefore, LED has is a soft and flexible surface.Although characteristics of silicone is to reduce thermal stress, but it is more susceptible to mechanical damage to the external forces applied on the surface. Pressure affects the reliability of light emitting diodes. In such circumstances, the assembly of organic silicon encapsulated LED products must comply with the appropriate measures to deal with. Avoid any pressure applied to any part of the LED and use pneumatic nozzle. Otherwise it may lead to reduction in reliability, and impact of its life to the LED.
The temperature control
Product light foot temperature under 75 ºC which shall be controlled
Reflow soldering instructions
1.Reflow soldering is recommended to the use of clean free flux, and in accordance to the reflow curve. Maximum number of soldering is limited
2.When soldering, do not exert pressure during heating process.
Soldering
1.When manual soldering iron is used, it is recommended to use 20W anti-electro static soldering iron, soldering temperature must be kept below 360 ºC / 3 seconds, 1Time soldering only
2.Do not mix different BIN materials on the same board, otherwise it will cause LED color Variation.
Repair
When repairing light-emitting diodes, it is advised to confirm the light emitting diode will be damaged, the repair process should avoid contact with the colloid surface, use of soldering iron should be according to following diagram
Clean
Recommend the use of pure alcohol to clean, wash and wipe or dipping no more than 1 minutes after soldering. When different solvents are used for cleaning, make sure that solvents do not damage the light emitting diode packaging.
Potting
1.The use of silicone rubber (plastic glass) for potting, it is recommended the use of alcoholic encapsulating Material.
2.When deoximation neutral potting material is used, make sure that the potting curing process in well-ventilated. . Do not perform sealing assembly of Light Emitting Diodes before potting is completely cured and setting process is completed. This will result in the silver layer oxidation and luminous color fades, light degradation and even dead LED
3.Prohibit the use of acetic acid type (acidic) silicone rubber potting materials
4.It is recommended that small quantity samples are made for potting test, Room temperature light test of 168H confirming no abnormality before mass products.
5.When there is change in potting material, please make samples to confirm whether there is erosion reaction. Take 5-10 grams of potting material and 10-20 pcs in a 100ml sealed containers for 168H confirm whether there is abnormality.
Static electricity
1.Workshop floors to use of the anti-static flooring and grounding, anti-static work bench, when charged material is in contact with low resistance metal surface, due to acute discharge,possibility of product failure is very high, so the requirements of the bench and any contact with the products should have surface resistance of 106-109Ω table mats
2.Production machines such as: tin furnace, reflow soldering, SMT equipment, electric soldering iron, and testing equipment need to be grounded, grounded AC impedance less than 1.0 ohm. Prone to static electricity environment and equipment must be installed ion fan. During working process, operators to wear anti-static clothing, wrist strap, gloves, and etc., When handling, hold the insulated part of the product as much as possible.
3.For packaging of LED, anti-static component boxes, packaging materials should be use.
4.Keep ambient humidity below 60% RH to avoid air being too dry to generate static electricity.
5.Grounding should be connected to the neutral input line. It should be separated from the lightning grounding. Grounding should be done with anti-static. Heavy gauge copper cable should be connected to a large piece of metal and buried at least 1 meter deep into the ground. All ground cables must be connected together with the main cable.
Storage
1.Recommended storage conditions before opening packaging: 5 ºC -30 ºC / <60% RH, retention period of one year
2.After opening of packaging: Room temperature <30 ° C, humidity < 60% RH. It is recommended to complete the reflow soldering operations in
4Hours. Complete LED packaging operations within 12 hours. If LED absorbed moisture prior to high temperature reflow soldering process, it will cause silicone and PPA to separate leading to component failures. Unused products, perform dehumidification procedure (reel products 75 ° C ± 5 ° C / 12H, bulk products, 110 ° C ± 5 ° C / 1H, natural cooling 1H inside oven) before reuse.
3.In the case of vacuum packing leakage, do not use,Use only after.
Operating diagram
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