Gold Wire 10W RGB Copper Stent Sanan Chip High Power LED

• Customization: Available
• LED Packaging Type: Chip
• Chip Material: AlGaInP
• Model NO.: high power
• Beam Angle: 120°
• Emitting Color: RGB
• IP Rating: IP33
• Base Material: Copper
• LED Chips: Sanan
• Power: 10W
• Life: 30000h
• Certification: RoHS
• Voltage(V): R:6-7V,B/G:9-11V
• Wavelength: R:620-630nm/B:462-470nm/G:520-530nm
• Current: 3*350mA
• Warranty(Year): 1 Year
• Storage Temperature(ºC): -40° -- 80°
• ESD Sensitivity: 2000V Hbm
• Transport Package: Carton
• Specification: 23*20*3.3MM
• Trademark: RZXLED
• Origin: China
• Production Capacity: 100000/Week
• Package Size: 2.00cm * 2.00cm * 1.00cm
• Package Gross Weight: 0.001kg

Product Description

 

Product Description

Luminous Flux	R	140-180LM
	G	150-210LM
	B	40-60LM
Color Temperature	R	620-625NM
	G	520-530NM
	B	460-466NM
Forward Voltage	R	6-7V
	G	9-11V
	B	9-11V

Dimensions

Notes:
1.All dimensions are in millimeters.
2.Tolerance is ±0.11mm unless otherwiase noted.

Remarks:
1. Light-emitting brightness is according to human eye simulation of the induction curve of luminous intensity in line with the CIE (International Light Committee Organization)
2. 1/2 angle is from optical centerline at the luminous intensity is 1/2 the optical centerline value
3. Brightness tolerance is guaranteed within plus or minus 5%
The optical measurement data by RZXLED equipment test.
 

Characteristics

Typical electrical-optical   Characteristics curvers

Relative spectral emission
Typical Electrical /Optical character Curves
(25°Ambient Temperature Unless Otherwise Noted)

Application&Feature

 

Application:
1.Stage lights
2.wall washers
3.traffic lights
4.indoorand outdoor lighting sources

Feature
1.Dimension 23mm×20mm×3.3mm
2.Wide viewing angle : 120°
3.RoHS compliant
4.Suitable for manual or low temperature heating station welding, high temperature reflow soldering
is prohibited.

Notes:
Packaged LED material is silicone nature, therefore, LED has is a soft and flexible surface.Although characteristics of silicone is to reduce thermal stress, but it is more susceptible to mechanical damage to the external forces applied on the surface. Pressure affects the reliability of light emitting diodes. In such
circumstances, the assembly of organic silicon encapsulated LED products must comply with the appropriate measures to deal with. Avoid any pressure applied to any part of the LED and use pneumatic nozzle. Otherwise it may lead to reduction in reliability, and impact of its life to the LED.

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