Quality 2835 0.2W SMD 620nm 630nm LED Chip

Product Details
Customization: Available
LED Packaging Type: SMD LED
Beam Angle: 120°
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  • Quality 2835 0.2W SMD 620nm 630nm LED Chip
  • Quality 2835 0.2W SMD 620nm 630nm LED Chip
  • Quality 2835 0.2W SMD 620nm 630nm LED Chip
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  • Overview
  • Specification
  • Certifications
  • Packaging & Shipping
Overview

Basic Info.

Emitting Color
RGBW
LED Chips
China Chip
Power
0.2W
Life
10000h
Certification
RoHS, CE
Item
2835 SMD LED
Transport Package
24*24*5
Specification
4000 PCS/Roll
Trademark
RZXLED
Origin
China
HS Code
8541410090

Packaging & Delivery

Package Size
24.00cm * 24.00cm * 5.00cm
Package Gross Weight
0.800kg

Product Description

 

 


 

Specification

 
 

 

Quality 2835 0.2W SMD 620nm 630nm LED ChipQuality 2835 0.2W SMD 620nm 630nm LED Chip

Note: Packaged LED material is silicone nature, therefore, LED has is a soft and flexible surface.
Although characteristics of silicone is to reduce thermal stress, but it is more susceptible to
mechanical damage to the external forces applied on the surface. Pressure affects the reliability of light emitting diodes. In such circumstances, the assembly of organic silicon encapsulated LED products must comply
with the appropriate measures to deal with. Avoid any pressure applied to any part of the LED and use pneumatic nozzle. Otherwise it may lead to reduction in reliability, and impact of its life to the LED.
 
Recommend the use of pure alcohol to clean, wash and wipe or dipping no more than 1
minutes after soldering. When different solvents are used for cleaning, make sure that
solvents do not damage the light emitting diode packaging.
 
(Storage)
1. Recommended storage conditions before opening packaging: 5 ºC -30 ºC / <60% RH,
retention period of one year.
2. After opening of packaging: Room temperature <30 ° C, humidity < 60% RH. It is
recommended to complete the reflow soldering operations in 4Hours. Complete LED
packaging operations within 12 hours. If LED
absorbed moisture prior to high temperature reflow soldering process, it will cause silicone
and PPA to separate leading to component failures. Unused products, perform
dehumidification procedure (reel products 75 ° C ± 5 ° C / 12H, bulk products,
110 ° C ± 5 ° C / 1H, natural cooling 1H inside oven) before reuse.
3. In the case of vacuum packing leakage, do not use,Use only after.

Certifications

Quality 2835 0.2W SMD 620nm 630nm LED Chip

 

 

Packaging & Shipping

 

Quality 2835 0.2W SMD 620nm 630nm LED ChipQuality 2835 0.2W SMD 620nm 630nm LED Chip

 

Quality 2835 0.2W SMD 620nm 630nm LED Chip


 

 

 

 

 

 

 

 

 

 

 

 

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